For more than 25 years, Flow Electronic Materials has been a leader in the supply of silicon solar cell pastes. At the North American Intersolar exhibition from July 12th to 14th, Flow introduced two latest back-side conductive silver pastes. These two new products can reduce the cost per watt while maintaining the same adhesion, weldability and field reliability as existing products.

PS2130 and PS2131 back silver paste

The two new products of American Flow are pure silver paste, which can be printed quickly at a speed of 200mm/sec. They have good compatibility with the aluminum paste on the back, and the co-firing window is very wide. They can form very good adhesion with silicon wafers, have robust and powerful solderability, and have passed component testing. PS2130 and PS2131 silver pastes are in line with RoHS and REACH standards, and are free of lead, cadmium, and benzene.

Two products are a new way to reduce costs

The designed sintering thickness of PS2130 and PS2131 are 5-7 microns and 4-6 microns, respectively. Calculated based on the current cost of silver and a factory with an annual production capacity of 500MW solar silicon cells, compared with Flow’s existing lead-free and energy-saving conductive silver paste, the use of these new pastes can save solar cell plants by 500 per year. Ten thousand dollars.

"This new product reduces the cost of ownership by simultaneously reducing precious metal content and printing consumption, and improves the competitive advantage of solar energy costs." said Todd Williams, Business Manager of Flow Electronic Materials Division, USA. "PS2130 and PS2131 reduce costs while maintaining the excellent mechanical properties of previous products."